Our comprehensive liquid cooling solutions address diverse ICT infrastructure needs:
Cold Plate Technology utilizes metal heat sinks to directly cool high-power chips, enabling PUE reduction to 1.2-1.3 for retrofitted data centers.
Immersion Cooling submerges entire servers in dielectric fluids, offering single-phase (PUE~1.1) and two-phase (PUE~1.05) variants for extreme density.
Phase-Change Cooling (a subset of immersion) leverages liquid-to-gas phase transitions for 30% higher thermal efficiency, ideal for HPC environments.
This hybrid approach delivers scalable, energy-efficient thermal management across all computing scales.
Phase change liquid cooling technology utilizes fluorinert fluids' latent heat absorption (150-180 kJ/kg) for chip-level thermal management:
Heat Absorption: Coolant flows through heat sources (e.g., CPUs/GPUs), absorbing heat via convection;
Phase Transition: Liquid vaporizes at 40-60°C, carrying away massive latent heat;
Heat Dissipation: Vapor condenses in heat exchangers, releasing heat to external environment;
Closed-loop Circulation: Condensed liquid returns via micropumps, forming a zero-loss cycle.
Key Variants:
Two-phase Cold Plate: Dominant solution (300W/cm² heat flux), compatible with standard servers;
Immersion Cooling: Full equipment submersion, supports 100kW/rack but requires high CAPEX.
National Supercomputing Center: Sugon's solution achieves 100kW/rack with 5% GPU performance boost;
China Mobile AI Hub: 100 liquid-cooled racks reduce energy consumption by 40% annually;
Financial Data Center: Temperature fluctuation controlled within ±1°C, lowering transaction latency by 15%.
Next-gen Chips: NVIDIA Rubin (TDP>1500W) will adopt hybrid two-phase/immersion cooling;
Material Shift: Aluminum cold plates replace copper, cutting costs by 30%;
Policy Incentives: China mandates PUE≤1.25 for new data centers, accelerating liquid cooling adoption.
