Our comprehensive liquid cooling solutions address diverse ICT infrastructure needs:
Cold Plate Technology utilizes metal heat sinks to directly cool high-power chips, enabling PUE reduction to 1.2-1.3 for retrofitted data centers.
Immersion Cooling submerges entire servers in dielectric fluids, offering single-phase (PUE~1.1) and two-phase (PUE~1.05) variants for extreme density.
Phase-Change Cooling (a subset of immersion) leverages liquid-to-gas phase transitions for 30% higher thermal efficiency, ideal for HPC environments.
This hybrid approach delivers scalable, energy-efficient thermal management across all computing scales.
Technical Principle
Attaches metal plates (copper/aluminum) with microchannels to high-heat components (CPU/GPU). Coolant (typically water-glycol) circulates through plates while other components use air cooling.
Key Features
Precision Cooling: CPU core temperature fluctuation <±3℃;
Retrofittable: Compatible with standard server racks;
Hybrid Cooling: Liquids handle 70% of heat load;
Leakage Control: Multi-layer sealing (e.g., DLC connectors with leakage rate <10⁻⁶ mbar·L/s).
Applications
Enterprise cloud DCs (e.g., Alibaba Cloud Zhangbei DC);
AI training clusters (NVIDIA DGX optional configuration);
HFT servers (maintaining CPU turbo frequency continuously).
