ATC has full capacility in in cold plate design, simulationproduction and test.
Product Features
- High reliability, high density, no leakage.Optimized internal channel and high-density skiving-fin designANSYS /6SigmaET thermal simulation capability
- Full set of cold plate manufacturing device, including water immersionultrasonic test, box-type helium detection, as well as flow resistance andthermal resistance test, etc.
- Meet Intel Whitley/Purley/Eagle Stream/OKS stream, AMD Genoa /Turin/Venice CPUs specifications
- Meet Nvidia H100 GB200 GPUs specifications
- Highly customizable cold plate design and production
Technical Features
• Skived-fin flow channel design, high heat dissipation efficiency
• Intel standard platform interface design, convenient installation and adaptation
• Copper material design, efficient heat conduction
• Integrated brazing design, high reliability
Material
• Cu1100
Parameters
• Rated flow rate: 1.0 L/min
• Working fluid type: 25% ethylene glycol water solution
• Thermal resistance: 0.035 K/W
• Outer diameter of connector: 6 mm
• Inner diameter of connector: 4.8 mm
• Pressure resistance: 8 Bar
