Our comprehensive liquid cooling solutions address diverse ICT infrastructure needs:
Cold Plate Technology utilizes metal heat sinks to directly cool high-power chips, enabling PUE reduction to 1.2-1.3 for retrofitted data centers.
Immersion Cooling submerges entire servers in dielectric fluids, offering single-phase (PUE~1.1) and two-phase (PUE~1.05) variants for extreme density.
Phase-Change Cooling (a subset of immersion) leverages liquid-to-gas phase transitions for 30% higher thermal efficiency, ideal for HPC environments.
This hybrid approach delivers scalable, energy-efficient thermal management across all computing scales.
Technical Principle
Submerges entire servers/motherboards in dielectric coolant (e.g., fluorocarbon or mineral oil). Heat is dissipated via liquid-phase circulation (single-phase) or boiling/condensation cycles (two-phase).
Key Features
Energy Efficiency: Achieves PUE 1.03-1.08, reducing energy consumption by >50% vs air cooling;
Near-silent Operation: Noise levels <50 dB;
High-density Support: Power density up to 100kW/rack;
Compatibility Limits: Requires sealed tanks; coolant costs ~$100/L (fluorinated fluids).
Applications
Supercomputing (e.g., modules of Fugaku supercomputer);
Bitcoin mining farms (cooling energy drops from 40% to 5% of total);
Edge computing pods (containerized immersion-cooled modules).
