Our comprehensive liquid cooling solutions address diverse ICT infrastructure needs:
Cold Plate Technology utilizes metal heat sinks to directly cool high-power chips, enabling PUE reduction to 1.2-1.3 for retrofitted data centers.
Immersion Cooling submerges entire servers in dielectric fluids, offering single-phase (PUE~1.1) and two-phase (PUE~1.05) variants for extreme density.
Phase-Change Cooling (a subset of immersion) leverages liquid-to-gas phase transitions for 30% higher thermal efficiency, ideal for HPC environments.
This hybrid approach delivers scalable, energy-efficient thermal management across all computing scales.
